Semiconductor Process Engineer

Semiconductor Mid-level (L4 equivalent) 2-5 years

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The job description

Tech stack. CVD, PVD, wet etch, diffusion/furnace, SPC, DOE, APC, process recipes, chamber matching, particle monitoring

About the role

A wafer fab needs a process engineer to own one or more front-end modules such as diffusion, thin films, or wet process, the layers where film quality and uniformity are set for everything downstream. You will develop and sustain stable recipes, qualify every process change through disciplined change control, and keep defectivity and parametric performance inside control limits across all shifts. This is the role that turns process margin into shipped wafers, and your modules either enable the technology or become its bottleneck.

What you will achieve

Deliver recipe qualifications that hold Cpk above 1.67 on all key process parameters for your modules, with capability studies refreshed quarterly or after any material or hardware change.
Reduce module-level defect adders by 20 percent through chamber matching, optimized clean frequencies, and particle-source elimination on your toolset.
Cut process-induced parametric shifts by running designed experiments that isolate root causes in under 2 weeks, replacing trial-and-error tuning with statistically valid conclusions.
Drive change-control execution so every recipe edit, material change, or hardware swap completes qualification without escapes, and no unqualified change ever reaches production lots.
Build automated SPC monitoring dashboards that flag drift 24 hours before it becomes an excursion, giving the team time to act instead of react.

What you will bring

Must-haves

BS or MS in chemical engineering, materials science, chemistry, physics, or electrical engineering.
2 to 5 years as a process engineer in a semiconductor fab, with diffusion, thin film, or wet process module ownership preferred.
Hands-on experience with CVD, PVD, or furnace processes, including recipe development and process window definition.
Proven use of DOE and statistical analysis to drive process improvements, with examples of experiments that changed a production recipe.
Knowledge of FMEA and change-control discipline in a production environment, including risk assessment for process modifications.
Ability to work on-call rotations and respond to excursion pages with structured troubleshooting under time pressure.

Nice-to-haves

APC (advanced process control) or run-to-run control experience, including model building and controller tuning.
Experience with atomic layer deposition or plasma-enhanced CVD tools and their unique control challenges.
Familiarity with TCAD or process simulation for recipe exploration before committing fab time.