Board Level Hardware Engineer

Hardware Engineer Mid-level (L4 equivalent) 2-5 years

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The job description

Tech stack. PCB design and layout oversight, stackup design, impedance control, fabrication processes, assembly processes, DFM and DFT, IPC standards, Gerber and ODB++ packages

About the role

You will own printed circuit boards as complete engineered products: stackup, materials, fabrication, and assembly, from design intent to delivered panels. Board-level hardware engineers bridge schematic intent and physical reality, making the hundreds of small decisions that determine whether a board builds cleanly, tests easily, and survives its operating environment. You will work directly with fabricators and assemblers, speak their language fluently, and design boards that factories love to build because everything was specified correctly the first time. This is a specialty where manufacturing knowledge compounds into serious leverage.

What you will achieve

Deliver optimized PCB stackups balancing signal integrity, power delivery, cost, and fabrication capability for each product's specific needs
Achieve high first-pass assembly yields through DFM-focused design: correct footprints, thoughtful panelization, fiducials, and process-compatible features
Reduce fabrication costs through smart material selection, layer count optimization, and tolerance management backed by engineering analysis
Resolve factory issues quickly during NPI builds with clear communication, fast accurate ECOs, and root-cause fixes that prevent repeats
Build strong fabricator and assembler relationships that secure engineering support, priority scheduling, and honest capability feedback

What you will bring

Must-haves

2 to 5 years working with PCB design, fabrication, or assembly engineering at the board level in production environments
Deep understanding of PCB fabrication processes: stackup construction, via types, surface finishes, and solder mask options and trade-offs
Knowledge of impedance control: calculating trace geometries, specifying controlled impedance, and verifying results with TDR measurement
Familiarity with assembly processes: reflow profiles, wave soldering, selective soldering, and their implications for design choices
Experience with DFM and DFT principles: test point placement strategy, ICT requirements, and functional test access planning
Ability to read and create fabrication drawings, assembly drawings, and Gerber packages that factories build from correctly without questions
BS in Electrical Engineering or equivalent professional experience

Nice-to-haves

Experience with HDI, rigid-flex, or other advanced PCB technologies and their specific design rules
Familiarity with IPC standards including IPC-2221, IPC-A-600, and IPC-A-610 and their practical application
Knowledge of PCB material science: laminate selection for RF, high-speed digital, or harsh environment applications
Experience with embedded components or other advanced packaging-in-board techniques